Epo-Tek H20S adhesive

Epo-Tek H20S adhesive

  • $496.00
Product Code: EMS12672-20S

Availability:

Epo-Tek® H20S is a modified version of EpoTek®H20E.
Epo-Tek® H20S is a highly reliable, two component, silver-filled epoxy with a smooth, thixotropic consistency (mixing ratio 1:1). This modified version offers high electrical conductivity, short curing cycles, proven reliability, and the convenient mix ratio, Epo-Tek® H20S is extremely simple to use. Epo-Tek® H20S pot life is 2.5 days and shelf life is one year when store at room temperature.
Maximum Bond Line Cure Schedules:
175°C ..........................................45 seconds
150°C ............................................5 minutes
120°C ..........................................15 minutes
100°C ..........................................45 minutes
80°C ............................................90 minutes

Physical Properties:
Color: Part A – silver; Part B – silver
Consistency: Smooth, thixotropic – 4000 cPs
Viscosity (@ 100 RPM / 23°C): 1,800 – 2,800 cPs
Thixotropic Index: 5
Glass Transition Temp (Tg): = 80°C (Dynamic cure 20 – 200°C / ISO 25 Min;
Ramp -10 – 200°C @20°C/Min)
Coefficient of Thermal Below Tg: 31 x 10-6 in/in/°C
Expansion (CTE): Above Tg: 120 x 10-6 in/in/°C
Shore D Hardness: 57
Lap Shear Strength @ 23°C: 1,240 psi
Die Shear Strength @ 23°C: = 5 kg / 1,700 psi
Weight Loss: @200°C: 0.40%; @250°C: 0.60%; @300°C: 1.37%
Degradation Temp (TGA): 414°C
Operating Temp: Continuous: -55°C to 200°C Intermittent: -55°C to 300°C
Storage Modulus @ 23°C: 339, 720 psi
Ion: Cl- 162 ppm; Na+ 0 ppm NH4 + 282 ppm
Particle Size: = 20 microns
Electrical Properties: Volume Resistivity @ 23°C: = 0.0005 Ohm-cm
Thermal Properties: Thermal Conductivity: 3.25 W/mK