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Epo-Tek H20E Adhesive

This product can only be shipped by road.

Prices are current as of Wednesday, 19/06/2019.
Prices are GST exclusive. Tax is added at checkout.

Product Code: EMS12671-20E

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EPO-TEK® H20E is a two component, 100% solids silver-filled epoxy system for chip/electronic bonding in microelectronic and optoelectronic as well as SEM mounting applications. Used extensively for themal management applications due to its high thermal conductivity.

  • EPO-TEK® H20E features high thermal conductivity, and is very well suited for extensive high temperature applications (300-400°C)
  • Extremly reliable conductive adhesive choice for new and old applications
  • H20E contains no solvents and will not outgas
  • When cured, H20E is resistant to solvents, resin and moisture
  • Long Pot life (2½ days)
  • Shelf life is one year when store at 23°C

Maximum Bond Line Cure Schedule:

175°C 45 seconds
150°C 5 minutes
120°C 15 minutes
80°C 3 hours

Typical properties:

(To be used as a guide only, not as a specification. Data below is NOT guaranteed. Different batches, conditions and applications yield differing results; Cure condition: 150°C/1 hour; *denotes test on lot acceptance basis)

Physical Properties

*Color: Part A: silver; Part B: silver
*Consistency: Smooth, thixotropic paste
*Viscosity (@ 100 RPM / 23°C): 2,200-3,200 cPs
Thixotropic Index: 4.63
Glass Transition Temp (Tg): ≥80°C (Dynamic cure 20 – 200°C / ISO 25 Min; Ramp -10 to 200°C @ 20°C/Min)
Coefficient of Thermal Expansion (CTE): Below Tg: 31 x 10-6 in/in/°C
Above Tg: 158 x 10-6 in/in/°C
Shore D hardness:  75
Lap Shear Strength @ 23°C: 1,475 psi
Die Shear Strength @ 23°C: >10 kg / 3,400 psi
Degradation Temp (TGA): 425°C
Weight Loss:

@ 200°C: 0.59%
@ 250°C: 1.09%
@ 300°C: 1.67%

Operating Temp: Continuous: -55°C to 200°C
Intermittent: -55°C to 300°C
Storage Modulus @ 23°C: 808,700 psi
Ions: Cl- 73 ppm
Na+ 2 ppm
NH4+ 98 ppm
K+ 3 ppm
*Particle Size: ≤45 microns

Electrical Properties

*Volume Resistivity @ 23°C: ≤0.0004 Ohm-cm

Thermal Properties

Thermal Conductivity: 2.5 W/mK, Based on standard method: Laser Flash
  29 W/mK, Based on Thermal Resistance Data: R = L x K-1 x A-1
Thermal Resistance: (Junction to Case): TO-18 package with nickel-gold metallized 20 x 20 mil chips and bonded with EPO-TEK H20E (2 mils thick)
EPO-TEK®H20E: 6.7 to 7.0°C/W
Solder: 4.0 to 5.0°C/W


Orders with items in stock are packed within 24 hours. We ship with our best choice of courier, depending on goods ordered and shipping address provided.


Standard delivery

Express delivery


Next day



2-3 business days



4-10 business days

2-3 business days


6-14 business days

2-3 business days



5-14 business days

*Note: Delivery times are as provided by our carriers and are estimates only. Delays may occur during peak periods, and due to factors outside the carriers' control.

Standard shipping is $15 in Australia (free on orders over $200). Add $5 to ship Express (under 2kg only)


Order online and collect from our warehouse in Townsville.


Freight Charge

Ready for collection

11 Carlton Street, Kirwan


Once invoice has been emailed
(Less than 1 business day)

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